Συντάχθηκε 12-05-2015 12:51
από Dionysios Pnevmatikatos
Email συντάκτη: dpnevmatikatos<στο>tuc.gr
Ενημερώθηκε:
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Ιδιότητα: ΔΕΠ ΗΜΜΥ.
Ομιλία Βασίλη Παυλίδη, University of Manchester
Past, Present, and the Future of Three-Dimensional (3-D) Integration
Τετάρτη 13/5, 1:15μμ, Αμφιθέατρο Επιστημών
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Past, Present, and the Future of Three-Dimensional (3-D) Integration
Vasilis F. Pavlidis, Advanced Processor Technologies (APT) Group
School of Computer Science, University of Manchester, Manchester UK
Abstract
Three-dimensional (3-D) or vertical integration is considered an
emerging technology that can alleviate the many challenges faced by
semiconductors industry. The paradigm of vertically integrating circuits
to form multi-tier stacks, however, dates back several decades. Specific
design and manufacturing challenges have recently put 3-D integration in
the spotlight. Thus, this talk will preview the history of 3-D
integration emphasizing the potential of this technology as well as the
state-of-the-art. Issues that have delayed the high volume manufacturing
of 3-D integrated systems will be briefly mentioned.
Research highlights relating to the design of a prototype 3-D test
circuit and the effects of process and environmental variations will be
presented, offering insight in the design of 3-D clock distribution
networks. Open research problems related to multi-tier circuits and
opportunities to work on these problems will also be discussed. Other
research activities within the APT group will be described including the
many-core architecture spiNNaker architecture which is the fundamental
component of the (under-construction) one million core machine!
Short Biography
Vasilis F. Pavlidis received the Diploma and MEng degrees from the
Democritus University, Xanthi, Greece, in 2000 and 2002, respectively.
He also received the MSc and PhD degrees from the University of
Rochester, Rochester, NY, in 2003 and 2008, respectively, all in
Electrical and Computer Engineering. From 2008-2012, he was a
post-doctoral researcher with the Integrated Systems Laboratory directed
by Prof. Giovanni De Micheli at EPFL, Lausanne, Switzerland. Since 2012,
he has been a Lecturer within the Advanced Processor Technologies group
at the School of Computer Science, of the University of Manchester. His
current research interests include the area of interconnect modeling,
3-D integration, networks-on-chip, and related design issues in VLSI. He
is the co-creator of the “Rochester cube” and co-author of the book
“Three dimensional integrated circuit design”. His research activities
are funded by EPSRC, EC-H2020, and ARM with which he closely collaborates.
Συντάχθηκε 19-05-2015 09:03
από Michail Lagoudakis
Email συντάκτη: lagoudakis<στο>tuc.gr
Ενημερώθηκε:
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Ιδιότητα: ΔΕΠ ΗΜΜΥ.
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